The method that primarily uses polyolefin or polyamide supplies was created to encapsulate and defend electric elements that include circuit boards from numerous environmental factors. They are designed to protect components from moisture, vibration, dirt, and dust. Sealing connectors, straining reliefs, and molding garments are offered by this process.
Elements such a specialized shaping device and raw materials are the key point of this method. These low pressure molding processes make use of dimer acid and polyamide based materials to mold compounds. This method is considered as the innovative manufacturing procedure which incorporates the injection of potting and molding wherein the hot melt adhesives are injected at low pressures.
This kind of usage became a cheaper substitute for epoxy setting which was used to assure the safeguard of delicate components. Their usage for cable and connector molding is effective in relieving tensions in comparison to a conventional plastic injection. They are equipped with the capacity to complete a seal for the pieces to guarantee a water tight encapsulation, and efficiently relieve strains.
Low viscosity gave them the opportunity to inject the material placed in a low pressure which keeps a wire and piece away from dislocation and harm. An easy encapsulation of a fragile element is attained to safeguard them from the fumes caused by their processing and materials. A conventional method primarily starts by giving the cases a shape, and then afterwards, is palletized.
The insertion of the electronic components and preheating them follows subsequently. After the preheating procedure, they are encapsulated, settled, and vacuumed, and testing and curing them comes last. The low pressure method flow is completed by inserting the pieces followed by their over molding, and testing them comes after.
The entire concept which governs over molding procedures is that they have the capability to replace potting or housing processes with a single practice. It is in this method that sealing huge PC boards with the usage of external connectors is primarily used before encasing them. The encapsulation process of the delicate elements is carried out before the traditional ones are.
Over molding different figures is recommended, and placing a high performance and sensitive piece is next. A molded tension relief and grommet, sealed wire, and utilization of tension relief are the fundamentals which allow you to obtain strain reliefs. In addition, the method which concentrates on sealing a micro switch is next practice to the fundamentals.
This procedure is created by Henkel Corporation which was located in Europe, and experiments about the usage of hot melt supplies to primarily seal connectors or create tension relief for numerous wires was conducted. But, the automotive industry was responsible for their commercial release. They were concerned on replacing toxic and oppressive potting methods with lighter and safer ones.
Ever since then, this method has been applied in various areas such as wire harness, military, consumer, medical, industrial products, and other items that require sealing processes, and the protection against the environment. Likewise, they could also be applied in various outputs such as control boards, moisture sensors, RFID tags, and USB thumb drive. Simply, if sealing methods and protection is needed, this process is the excellent solution.
Elements such a specialized shaping device and raw materials are the key point of this method. These low pressure molding processes make use of dimer acid and polyamide based materials to mold compounds. This method is considered as the innovative manufacturing procedure which incorporates the injection of potting and molding wherein the hot melt adhesives are injected at low pressures.
This kind of usage became a cheaper substitute for epoxy setting which was used to assure the safeguard of delicate components. Their usage for cable and connector molding is effective in relieving tensions in comparison to a conventional plastic injection. They are equipped with the capacity to complete a seal for the pieces to guarantee a water tight encapsulation, and efficiently relieve strains.
Low viscosity gave them the opportunity to inject the material placed in a low pressure which keeps a wire and piece away from dislocation and harm. An easy encapsulation of a fragile element is attained to safeguard them from the fumes caused by their processing and materials. A conventional method primarily starts by giving the cases a shape, and then afterwards, is palletized.
The insertion of the electronic components and preheating them follows subsequently. After the preheating procedure, they are encapsulated, settled, and vacuumed, and testing and curing them comes last. The low pressure method flow is completed by inserting the pieces followed by their over molding, and testing them comes after.
The entire concept which governs over molding procedures is that they have the capability to replace potting or housing processes with a single practice. It is in this method that sealing huge PC boards with the usage of external connectors is primarily used before encasing them. The encapsulation process of the delicate elements is carried out before the traditional ones are.
Over molding different figures is recommended, and placing a high performance and sensitive piece is next. A molded tension relief and grommet, sealed wire, and utilization of tension relief are the fundamentals which allow you to obtain strain reliefs. In addition, the method which concentrates on sealing a micro switch is next practice to the fundamentals.
This procedure is created by Henkel Corporation which was located in Europe, and experiments about the usage of hot melt supplies to primarily seal connectors or create tension relief for numerous wires was conducted. But, the automotive industry was responsible for their commercial release. They were concerned on replacing toxic and oppressive potting methods with lighter and safer ones.
Ever since then, this method has been applied in various areas such as wire harness, military, consumer, medical, industrial products, and other items that require sealing processes, and the protection against the environment. Likewise, they could also be applied in various outputs such as control boards, moisture sensors, RFID tags, and USB thumb drive. Simply, if sealing methods and protection is needed, this process is the excellent solution.
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